Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds
- Авторы: Brudnyi V.N.1, Vilisova M.D.1, Velikovskii L.É.1, Sim P.Е.1, Brudnyi P.A.1
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Учреждения:
- National Research Tomsk State University
- Выпуск: Том 61, № 8 (2018)
- Страницы: 1450-1456
- Раздел: Article
- URL: https://bakhtiniada.ru/1064-8887/article/view/240867
- DOI: https://doi.org/10.1007/s11182-018-1555-7
- ID: 240867
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Аннотация
Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.
Об авторах
V. Brudnyi
National Research Tomsk State University
Автор, ответственный за переписку.
Email: brudnyi@mail.tsu.ru
Россия, Tomsk
M. Vilisova
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Россия, Tomsk
L. Velikovskii
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Россия, Tomsk
P. Sim
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Россия, Tomsk
P. Brudnyi
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Россия, Tomsk
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