Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds
- Authors: Brudnyi V.N.1, Vilisova M.D.1, Velikovskii L.É.1, Sim P.Е.1, Brudnyi P.A.1
-
Affiliations:
- National Research Tomsk State University
- Issue: Vol 61, No 8 (2018)
- Pages: 1450-1456
- Section: Article
- URL: https://bakhtiniada.ru/1064-8887/article/view/240867
- DOI: https://doi.org/10.1007/s11182-018-1555-7
- ID: 240867
Cite item
Abstract
Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.
About the authors
V. N. Brudnyi
National Research Tomsk State University
Author for correspondence.
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk
M. D. Vilisova
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk
L. É. Velikovskii
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk
P. Е. Sim
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk
P. A. Brudnyi
National Research Tomsk State University
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk
Supplementary files
