Electrophysical and Physical-Chemical Properties of Ohmic Contacts to III-N Compounds


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Abstract

Experimental data on studying ohmic contacts based on single-layer and multilayer metallizations on GaN and (In, Al, Ga)N solid solutions are analyzed. The contact resistance of the Ti/Al/Mo/Au and Ti/Al/Mo/W/Au metallizations on undoped GaN is studied. The dependences of the contact resistance on the GaN surface treatment before the metallization and on the metallization annealing regimes are investigated.

About the authors

V. N. Brudnyi

National Research Tomsk State University

Author for correspondence.
Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk

M. D. Vilisova

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk

L. É. Velikovskii

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk

P. Е. Sim

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk

P. A. Brudnyi

National Research Tomsk State University

Email: brudnyi@mail.tsu.ru
Russian Federation, Tomsk

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