Dependence of Some Physical Characteristics of Epoxy Compounds on the Filler Parameters


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Abstract

The effect of the dispersion and thermophysical properties of the filler on the characteristics and aging of the UP5-162 epoxy compound is investigated. It is shown that the particle size and homogeneity of filler distribution affect significantly the internal mechanical stresses during compound curing. Thermal aging of the compound and resistance to thermal stresses are significantly influenced by the thermal conductivity and heat capacity of filler particles. The necessary condition of high mechanical properties and resistance to thermal aging of the compound is a narrow dispersion of filler particles.

About the authors

S. V. Kim

National Research Tomsk Polytechnic University

Author for correspondence.
Email: vyush@tpu.ru
Russian Federation, Tomsk

V. Ya. Ushakov

National Research Tomsk Polytechnic University

Email: vyush@tpu.ru
Russian Federation, Tomsk

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