Microplastic Deformation of Submicrocrystalline Copper at Room and Elevated Temperatures

Abstract

Results

of investigations of submicrocrystalline copper subjected to cold rolling after abc pressing by methods of backscatter electron diffraction and x-ray diffraction analysis are presented. It is demonstrated that after such combined intensive plastic deformation, the submicrocrystalline structure with average grain-subgrain structure elements having sizes of 0.63 μm is formed with relative fraction of high-angle grain boundaries of ~ 70% with texture typical for rolled copper. Results of investigation of microplastic deformation of copper with such structure at temperatures in the interval 295–473 K and with submicrocrystalline structure formed by cold rolling of coarse-grained copper are presented.