Residual stresses in silicon and their evolution upon heat treatment and irradiation
- 作者: Matyash I.E.1, Minailova I.A.1, Serdega B.K.1, Khirunenko L.I.2
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隶属关系:
- Lashkaryov Institute of Semiconductor Physics
- Institute of Physics
- 期: 卷 51, 编号 9 (2017)
- 页面: 1107-1110
- 栏目: Nonelectronic Properties of Semiconductors (Atomic Structure, Diffusion)
- URL: https://bakhtiniada.ru/1063-7826/article/view/201075
- DOI: https://doi.org/10.1134/S1063782617090147
- ID: 201075
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详细
The distributions of internal stresses in undoped and tin-doped silicon and the influence of electron irradiation with an energy of 5 MeV and of heat treatment at 450°C on the stresses are studied. The stresses are measured by a method based on the detection of birefringence by modulation polarimetry. It is shown that tin-doped silicon includes stripes of point defects with a nonuniform distribution of residual stresses of up to 20 kg cm–2. Heat treatment at 450°C induces an increase in the residual stresses in the sample to 50 kg cm–2. It is established that the radiation defects formed upon the irradiation of tin-doped silicon reduce the residual stresses to 2–3 kg cm–2.
作者简介
I. Matyash
Lashkaryov Institute of Semiconductor Physics
Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028
I. Minailova
Lashkaryov Institute of Semiconductor Physics
编辑信件的主要联系方式.
Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028
B. Serdega
Lashkaryov Institute of Semiconductor Physics
Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028
L. Khirunenko
Institute of Physics
Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028
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