Residual stresses in silicon and their evolution upon heat treatment and irradiation


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The distributions of internal stresses in undoped and tin-doped silicon and the influence of electron irradiation with an energy of 5 MeV and of heat treatment at 450°C on the stresses are studied. The stresses are measured by a method based on the detection of birefringence by modulation polarimetry. It is shown that tin-doped silicon includes stripes of point defects with a nonuniform distribution of residual stresses of up to 20 kg cm–2. Heat treatment at 450°C induces an increase in the residual stresses in the sample to 50 kg cm–2. It is established that the radiation defects formed upon the irradiation of tin-doped silicon reduce the residual stresses to 2–3 kg cm–2.

作者简介

I. Matyash

Lashkaryov Institute of Semiconductor Physics

Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028

I. Minailova

Lashkaryov Institute of Semiconductor Physics

编辑信件的主要联系方式.
Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028

B. Serdega

Lashkaryov Institute of Semiconductor Physics

Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028

L. Khirunenko

Institute of Physics

Email: irinaminailiva125@gmail.com
乌克兰, Kyiv, 03028

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