🔧На сайте запланированы технические работы
25.12.2025 в промежутке с 18:00 до 21:00 по Московскому времени (GMT+3) на сайте будут проводиться плановые технические работы. Возможны перебои с доступом к сайту. Приносим извинения за временные неудобства. Благодарим за понимание!
🔧Site maintenance is scheduled.
Scheduled maintenance will be performed on the site from 6:00 PM to 9:00 PM Moscow time (GMT+3) on December 25, 2025. Site access may be interrupted. We apologize for the inconvenience. Thank you for your understanding!

 

Formation of Porous Silicon by Nanopowder Sintering

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

The technique of the electrochemical and photoelectrochemical etching of single-crystal silicon wafers commonly used to fabricate macroporous silicon layers is inefficient and costly. An alternative method for forming bulk macroporous silicon is the high-temperature sintering of Si powder. The process of nanopowder sintering preliminarily subjected to dry cold compression (without binding additives) is investigated. The properties of the sintered material, including its microstructure, density, and electrical conductivity, are studied at different annealing temperature and time. Techniques for changing the porosity of the sintered samples and for determining of the interior surface area are discussed.

作者简介

E. Astrova

Ioffe Institute

编辑信件的主要联系方式.
Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

V. Voronkov

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

A. Nashchekin

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

A. Parfeneva

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

D. Lozhkina

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

M. Tomkovich

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

Yu. Kukushkina

Ioffe Institute

Email: east@mail.ioffe.ru
俄罗斯联邦, St. Petersburg, 194021

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Ltd., 2019