Technological Processes and Routes

标题 文件
卷 53, 编号 15 (2019) Influence of the Metallization Composition and Annealing Process Parameters on the Resistance of Ohmic Contacts to n-type 6H-SiC PDF
(Eng)
Egorkin V., Zemlyakov V., Nezhentsev A., Gudkov V., Garmash V.
卷 53, 编号 15 (2019) Investigation of the Initial Silicon-on-Sapphire Layer Formed by CVD Techniques PDF
(Eng)
Fedotov S., Sokolov E., Statsenko V., Romashkin A., Timoshenkov S.
卷 53, 编号 15 (2019) Study of the Formation Process of Memristor Structures Based on Copper Sulfide PDF
(Eng)
Belov A., Golishnikov A., Mastinin A., Perevalov A., Shevyakov V.
卷 53, 编号 15 (2019) Mathematical Model of the Evaporation of Amalgam Components in Discharge Radiation Sources PDF
(Eng)
Petrenko N., Puchnina S., Gavrilov S.
卷 53, 编号 15 (2019) Predicting the Conditions for the Vapor-Phase Epitaxy of the III–V Compounds PDF
(Eng)
Vigdorovich E.
卷 52, 编号 15 (2018) Dependence of Mechanical Stresses in Silicon Nitride Films on the Mode of Plasma-Enhanced Chemical Vapor Deposition PDF
(Eng)
Novak A., Novak V., Dedkova A., Gusev E.
卷 52, 编号 15 (2018) Using Combined Optical Techniques to Control the Shallow Etching Process PDF
(Eng)
Volokhovskiy A., Gerasimenko N., Petrakov D.
卷 52, 编号 15 (2018) Characteristics of Amorphous As2S3 Semiconductor Films Obtained via Spin Coating PDF
(Eng)
Hang Thi Nguyen ., Yakubov A., Lazarenko P., Volkova A., Sherchenkov A., Kozyukhin S.
卷 52, 编号 15 (2018) Investigating the RTA Treatment of Ohmic Contacts to n-Layers of Heterobipolar Nanoheterostructures PDF
(Eng)
Egorkin V., Zemlyakov V., Nezhentsev A., Garmash V.
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