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Deposition of Silicon Films Doped with Boron and Phosphorus by the Gas-Jet Plasma-Chemical Method


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Abstract

Doped silicon films are fabricated using diborane and phosphine as doping gases by gas-jet plasma-chemical deposition with the application of an electron beam. The influence of the dopant-gas concentration, the addition of a fluorine-containing gas, and the background pressure on the conductivity and crystalline structure of silicon layers is investigated. Boron-doped amorphous films (a-Si:H) with a conductivity up to 5.2 × 10–3 (Ω cm)–1 are fabricated; when doping with phosphorus, microcrystalline silicon films (mc-Si:H) with a crystallinity up to 70% and conductivity at a level of 1 (Ω cm)–1 are fabricated.

About the authors

V. G. Shchukin

Kutateladze Institute of Thermophysics, Siberian Branch, Russian Academy of Sciences

Email: konstantinov@itp.nsc.ru
Russian Federation, Novosibirsk, 630090

R. G. Sharafutdinov

Kutateladze Institute of Thermophysics, Siberian Branch, Russian Academy of Sciences

Email: konstantinov@itp.nsc.ru
Russian Federation, Novosibirsk, 630090

V. O. Konstantinov

Kutateladze Institute of Thermophysics, Siberian Branch, Russian Academy of Sciences

Author for correspondence.
Email: konstantinov@itp.nsc.ru
Russian Federation, Novosibirsk, 630090

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