Структура тонких пленок нитрида титана, сформированных методом магнитронного распыления
- Авторы: Исаев А.Г.1, Рогожин А.Е.1
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Учреждения:
- НИЦ “Курчатовский институт”
- Выпуск: Том 54, № 3 (2025)
- Страницы: 202-212
- Раздел: ДИАГНОСТИКА
- URL: https://bakhtiniada.ru/0544-1269/article/view/304932
- DOI: https://doi.org/10.31857/S0544126925030029
- EDN: https://elibrary.ru/pwnpmt
- ID: 304932
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Аннотация
Эта обзорная статья посвящена структуре тонких пленок нитрида титана, сформированных методом магнетронного распыления. Рассмотрена модель роста пленок в зависимости от температуры осаждения и потока азота. Проведено сравнение модели с экспериментальными результатами. Описано влияние отжигов на структуру пленок магнетронного нитрида титана.
Ключевые слова
Об авторах
А. Г. Исаев
НИЦ “Курчатовский институт”
Email: isaev.ag@phystech.edu
Москва, Россия
А. Е. Рогожин
НИЦ “Курчатовский институт”
Автор, ответственный за переписку.
Email: isaev.ag@phystech.edu
Москва, Россия
Список литературы
- Sharath S.U., Vogel S., Molina-Luna L. Control of Switching Modes and Conductance Quantization in Oxygen Engineered HfOx based Memristive Devices // Adv. Funct. Mater. 2017. Vol. 27. № 32. P. 1700432.
- Isaev A.G., Permyakova O. О., Rogozhin A.Е. Mechanisms of conductive filament formation in hafnium oxide multilayer structures // Thin Solid Films. 2023. Vol. 781. P. 139993.
- Isaev A.G., Permyakova O.O., Rogozhin A.E. Oxide Memristors for ReRAM: Approaches, Characteristics, and Structures // Russ. Microelectron. 2023. Vol. 52. № 2. P. 74–98.
- Kohlhase A., Mändl M., Pamler W. Performance and failure mechanisms of TiN diffusion barrier layers in submicron devices // J. Appl. Phys. 1989. Vol. 65, № 6. P. 2464–2469.
- Kwak M.Y., Shin D.H., Kang T.W., Kim K.N. Characteristics of TiN barrier layer against Cu diffusion // Thin Solid Films. 1999. Vol. 339. № 1–2. P. 290–293.
- Vorobjova A.I., Labunov V.A., Outkina E.A., Grapov D.V. Metallization of Vias in Silicon Wafers to Produce Three-Dimensional Microstructures // Russ. Microelectron. 2021. Vol. 50. № 1. P. 8–18.
- Huang J.S., Oates A.S., Zhao J. Effect of cracks in TiN anti-reflection coating layers on early via electromigration failure // Thin Solid Films. 2000. Vol. 371. № 1–2. P. 310–315.
- Pan F., Gao S., Chen C. Recent progress in resistive random access memories: Materials, switching mechanisms, and performance // Mater. Sci. Eng. R Rep. 2014. Vol. 83. P. 1–59.
- Lanza M., Wong H.-S.P., Pop E. Recommended Methods to Study Resistive Switching Devices // Adv. Electron. Mater. 2019. Vol. 5. № 1. P. 1800143.
- Kajikawa Y., Noda S., Komiyama H. Comprehensive perspective on the mechanism of preferred orientation in reactive-sputter-deposited nitrides // J. Vac. Sci. Technol. Vac. Surf. Films. 2003. Vol. 21. № 6. P. 1943–1954.
- Patsalas P., Kalfagiannis N., Kassavetis S., Abadias G., Bellas D.V., Lekka Ch., Lidorikis E. Conductive nitrides: Growth principles, optical and electronic properties, and their perspectives in photonics and plasmonics // Mater. Sci. Eng. R Rep. 2018. Vol. 123. P. 1–55.
- Petrov I., Barna P.B., Hultman L., Greene J.E. Microstructural evolution during film growth // J. Vac. Sci. Technol. Vac. Surf. Films. 2003. Vol. 21. № 5. P. S117–S128.
- Mahieu S., Depla D., Gryse R.D. Modelling the growth of transition metal nitrides // J. Phys. Conf. Ser. 2008. Vol. 100. № 8. P. 082003.
- Mahieu S., Depla D. Reactive sputter deposition of TiN layers: modelling the growth by characterization of particle fluxes towards the substrate // J. Phys. Appl. Phys. 2009. Vol. 42. № 5. P. 053002.
- Mahieu S., Ghekiere P., Depla D., De Gryse R. Biaxial alignment in sputter deposited thin films // Thin Solid Films. 2006. Vol. 515. № 4. P. 1229–1249.
- Matacotta F.C., Ottaviani G. Science and technology of thin films. Singapore New Jersey London [etc.]: World scientific, 1995.
- Thornton J.A. High Rate Thick Film Growth // Annu. Rev. Mater. Sci. 1977. Vol. 7. № 1. P. 239–260.
- Li T.Q., Noda S., Tsuji Y., Ohsawa T., Komiyama H. Initial growth and texture formation during reactive magnetron sputtering of TiN on Si(111) // J. Vac. Sci. Technol. Vac. Surf. Films. 2002. Vol. 20. № 3. P. 583–588.
- Martinez G., Shutthanandan V., Thevuthasan S., Chessa J.F., Ramana C.V. Effect of thickness on the structure, composition and properties of titanium nitride nano-coatings // Ceram. Int. 2014. Vol. 40. № 4. P. 5757–5764.
- Yang H.H., Je J.H., Lee K.-B. Effect of the nitrogen partial pressure on the preferred orientation of TiN thin films // J. Mater. Sci. Lett. 1995. Vol. 14. № 23. P. 1635–1637.
- Je J.H., Noh D.Y., Kim H.K., Liang K.S. The crossover of preferred orientation in TiN film growth: A real time x-ray scattering study // J. Mater. Res. 1997. Vol. 12. № 1. P. 9–12.
- Zhou T., Liu D., Zhang Y., Ouyang T., Suo J. Microstructure and hydrogen impermeability of titanium nitride thin films deposited by direct current reactive magnetron sputtering // J. Alloys Compd. 2016. Vol. 688. P. 44–50.
- Chuang K.-L., Tsai M.-T., Lu F.-H. Morphology control of conductive TiN films produced by air-based magnetron sputtering // Surf. Coat. Technol. 2018. Vol. 350. P. 1091–1097.
- Huang J.-H., Yu K.-J., Sit P., Yu G.-P. Heat treatment of nanocrystalline TiN films deposited by unbalanced magnetron sputtering // Surf. Coat. Technol. 2006. Vol. 200. № 14–15. P. 4291–4299.
- Xi Y., Fan H., Liu W. The effect of annealing treatment on microstructure and properties of TiN films prepared by unbalanced magnetron sputtering // J. Alloys Compd. 2010. Vol. 496. № 1–2. P. 695–698.
- Kavitha A., Kannan R., Sreedhara Reddy P., Rajashabala S. The effect of annealing on the structural, optical and electrical properties of Titanium Nitride (TiN) thin films prepared by DC magnetron sputtering with supported discharge // J. Mater. Sci. Mater. Electron. 2016. Vol. 27. № 10. P. 10427–10434.
- Ghailane A. et al. Influence of Annealing Temperature on the Microstructure and Hardness of TiN Coatings Deposited by High-Power Impulse Magnetron Sputtering // J. Mater. Eng. Perform. 2022. Vol. 31. № 7. P. 5593–5601.
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