Effect of copper nanoparticle aggregation on the thermal conductivity of nanofluids

Abstract

The thermal conductivity of water and glycerol is investigated via the transient hot wire method by adding small amounts of copper nanoparticles to solutions. At a 0.2% copper nanoparticle concentration, the thermal conductivity coefficient rises to 25% for the Cu + glycerol system, and to 35% for Cu + water system. A mechanism and mathematical model for describing the nanoparticle aggregation effect on the thermal properties of nanofluids are proposed, based on an analysis of the accumulated experimental data. It is shown that the enhancement of nanofluid thermal conductivity at low nanoparticle concentrations is directly proportional to their volume fraction and thermal conductivity coefficient, and (in accordance with the literature data) is inversely proportional to the radius and the aggregation ratio. The proposed model describes the existing experimental data quite well. The results from this work can be applied to the rapid cooling of electronic components, in the power engineering for ensuring the rapid and effective transfer of thermal energy in a nuclear reactor, and in the oil industry for thermal stimulation.