The design and development of high-current leads on the basis of 2G HTS conductors


如何引用文章

全文:

开放存取 开放存取
受限制的访问 ##reader.subscriptionAccessGranted##
受限制的访问 订阅存取

详细

The feasibility of creating high-current leads on the basis of second-generation (2G) high-temperature superconductors (HTSs) was demonstrated. A method for graded soldering of 2G HTS tape stacks is proposed. It allows one to avoid negative effects that are related to an inhomogeneous current sharing between parallel HTS conductors. A prototype of HTS-coated current leads (CLs) was designed, manufactured, and tested; its critical current exceeds 18 kА. Prototypes of HTS CLs for the superconducting magnetic system of the Nuclotron accelerator (a part of the NICA collider) with an operating current of 6 kA were developed, manufactured, and tested in liquid helium (the overcurrent was 9 kA).

作者简介

A. Ilyin

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

V. Keilin

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

I. Kovalev

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

M. Makarenko

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

A. Naumov

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

S. Novikov

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

M. Novikov

Kurchatov Institute National Research Center

编辑信件的主要联系方式.
Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

A. Polyakov

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

M. Surin

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

V. Shcherbakov

Kurchatov Institute National Research Center

Email: mihailnovikov@yandex.ru
俄罗斯联邦, Moscow, 123182

补充文件

附件文件
动作
1. JATS XML

版权所有 © Pleiades Publishing, Inc., 2017