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Influence of neutron irradiation on etching of SiC in KOH


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Abstract

The effect of reactor neutron irradiation on the etch rate of SiC in potassium hydroxide has been studied. In the case of high irradiation doses (1019–1021 cm–2), the etch rate of silicon carbide has been shown to drastically rise, especially in the [0001]Si direction. This considerably mitigates the orientation anisotropy of polar face etching. After high-temperature annealing (up to 1200–1400°C), a higher etch rate of irradiated crystals persists. The results have been explained by the high concentration of radiation-induced (partially clustered) defects they contain.

About the authors

E. N. Mokhov

Ioffe Institute

Author for correspondence.
Email: mokhov@mail.ioffe.ru
Russian Federation, Politekhnicheskaya ul. 26, St. Petersburg, 184021

O. P. Kazarova

Ioffe Institute

Email: mokhov@mail.ioffe.ru
Russian Federation, Politekhnicheskaya ul. 26, St. Petersburg, 184021

V. A. Soltamov

Ioffe Institute

Email: mokhov@mail.ioffe.ru
Russian Federation, Politekhnicheskaya ul. 26, St. Petersburg, 184021

S. S. Nagalyuk

Ioffe Institute

Email: mokhov@mail.ioffe.ru
Russian Federation, Politekhnicheskaya ul. 26, St. Petersburg, 184021

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